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What is Pulse Heat (Hot Bar Reflow) Soldering ?
Pulse Heat (hot bar reflow) soldering is an instantaneous heating method which results in an immediate solder, thermocompression bond or resin weld between two workpieces.
The process is performed by combining instantaneous heat and pressure to the workpieces.
Resistance heat is generated by an electric current through a metal heating element called the heater chip/heater tool. This method is a unique development of Nippon Avionics.
The Pulse Heat Unit consists of a pulse heat power supply that controls the current, reflow head that holds and applies pressure to the workpieces to be welded and heater tip/heater tool that holds workpieces and generates resistance heat.
Compared to constant heat soldering methods, the pulse heat process has less thermal effect on peripheral components. It is widely used for narrow pitch soldering and thermo-compression bonding of ACF’s.